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TSMC and Samsung adopt ASML's High NA EUV tools as AI fuels demand for advanced chips

9/8/2026

The short version: two of the world's largest chipmakers have committed to a new generation of machine for printing circuits onto silicon.

High NA EUV, which stands for High Numerical Aperture Extreme Ultraviolet lithography, is ASML's newest class of chip-printing equipment.

TSMC and Samsung are both adopting it as artificial intelligence drives demand for chips that are smaller and more complex.

EUV lithography uses light with an extremely short wavelength to etch microscopic circuit patterns onto silicon wafers. The smaller the pattern the machine can print, the more computing capacity fits onto a single chip.