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Memory Chip Equipment Spending Set to Top $50 Billion in 2026, SEMI Projects

6/30/2026

Worldwide investment in 300mm fab equipment for the memory sector is on track to surpass $50 billion in 2026, according to a forecast released June 29 by SEMI, the global semiconductor industry association headquartered in Milpitas, California.

The organization projects that number could approach $80 billion annually by 2029, driven by AI-related demand for high-bandwidth memory, DDR5, and data storage products.

What "300mm Fab Equipment" Actually Means A fab is a chip factory, and 300mm refers to the diameter of the silicon wafers on which memory chips are printed.

Larger wafers mean more chips per production run and lower cost per unit — which is why the industry standardized on this format for high-volume manufacturing.

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